45 lines
1.0 KiB
INI
45 lines
1.0 KiB
INI
#
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# LeEco X3-55pro (Super3 x55 Pro)
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# Config file to pack a single partition to firmware file (recovery.img)
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#
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# This will NOT create the partition, just erase and rewrite it
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# NO security info (signature) will be added to the bin !
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# Security checking for recovery will be DISABLED
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# Use it to flash plain non encrypted recovery.img
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#
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[Main]
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FirmwareFileName=LetvUpgrade938-recovery.bin
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ProjectFolder=./pack
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useHexValuesPrefix=true
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SCRIPT_FIRMWARE_FILE_NAME=$$(UpgradeImage)
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DRAM_BUF_ADDR=20200000
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MAGIC_FOOTER=12345678
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HEADER_SIZE=16KB
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[HeaderScript]
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Prefix:
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Suffix:
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# Enable UART
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setenv UARTOnOff on
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# No auth for the recovery
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setenv recoverycmd mmc read.p 0x23000000 dtb 0x00100000\; mmc read.p 0x25000000 recovery 0x02000000\; bootm 0x25000000
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# setenv recoverycmd mmc read.p 0x25000000 recovery 0x02000000\; bootm 0x25000000
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# Done
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setenv selinux_force_disable 1
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setenv LetvUpgrade_complete 1
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setenv ResetAfterUpgrade 1
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setenv ForcePowerOn 0
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saveenv
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[part/recovery]
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erase=True
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imageFile=${Main:ProjectFolder}/recovery.img
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type=partitionImage |